Just got the new R835-P50X

[tlordon]

read below replies for firmware UPDATE NOTICE>

Does anyone have an older version of the Toshiba VAP? Perhaps it's a problem with this version.

yes here is a link to what i used and worked.
http://cdgenp01.csd.toshiba.com/cont...c00364500t.exe

here is the p50x link for all apps and dirvers just pic your os. if your clean install from above iso use win 7 64bit
Model Content Page

forget it! my company gave me an iso labeled "x64" but it's actually "x86". Rebuild!

here is a link to a good iso you can use this.. and just do all the updates after its done..
http://msft-dnl.digitalrivercontent..../X15-65733.iso

tlordon,
Having watched your youtube video the only thing I wondered about is how in the Toshiba video you incorporated he states the copper cooling grid is present in 13, 14 and 15 inch Business laptops. I believe the R835 is classed as a home/personal laptop rather than a business model as the R830 is, indicated in a variety of other features, so maybe this might account for the difference?

1. toshiba legal would have tried to pull that if they could have. (would have ended it all at the start) at least the claim i have about my personal laptop but my claim is still valid even on the "business" ones they admit they switched all to AL. so its still advertised as copper and shipps with AL. still have a class suit.

2. Edit i mispoke (but i correct myself) total laps in what i knew i criss crossed a few things internaly LOL
in a way you are right but in a way you are not.
im not going to debate the business class or not. rather i will explain it this way..
we are not comparing the IS vs ISF or 325 vs M3 ie the 830 vs 835.
yes the isf and m3 have more HP and changes to cosmetic and accys in the cars but the copper heatsink/coolinggrid/fins would be like havine a isf or m3 and using the IS exauhst system( would restrict) Ie the thin copper plate and AL fins will on us)
the way i took the video above all is the copper is on all machines in the 830 class that includes the 835.


as they the way the video implies the copper heatsink is part of the overal notebook cooling design in uk they dont have personal model and to top it all off even if you take my false adverstising/bait switch whatever u want to call it out of the equation, this is another 5005 suit as im sure they know internaly the shortcomings of the thin plate and AL fins/grid.
the system will slow down when gets hot and hence you will never truly see it at full speed (CPU) as it will throttle to keep cool.. IMPO even at settings to limit cpu speed reduction when it gets hot...

to that above even if the business class is right on the toshiba site uk the pictures are now of al fins so the suit is still valid..

I'm about to receive the nordic version of this laptop, or so i think, this week. Here it's callted Sattelite R830-13D and you can find the spec to it here.

I can attempt to check out the heatsink when I get it and I was planning of adding some memory and an SSD as well but I'll wait with that until I've evaluated fan noise and temperatures.

Is there anyting else that I should look for and what program was used to examine temperatures?

sorry i deleted some of your quote. trying to keep this post small.
thanks for letting us know..
when you get it look on the left side and see if the metal not screen is silver or copper color. you wont have to open it. (but if it is copper i will ask another step)

the stock toshiba pc health monitor (type that in the serach box and it will open) or use CPU ID pro or personal both free. (pro you can buy for more info than we need here)
Record room temp and if under load or not. (lets be fair to toshiba)











***Update New firmware package 2.6*****

http://cdgenp01.csd.toshiba.com/cont...s/t320v260.exe
Change History

Version 2.60 - 2011-05-13
Added support for TOSHIBA Hi-Speed Start.
Updated the Tecra/Satellite R840 AMD VGA BIOS - Optimized stretch.
Version 2.40 - 2011-05-09
Updated the Tecra/Satellite R840 AMD VGA BIOS - Changed the value of AMD PowerPlay when using the internal LCD and an external display.
Version 2.30 - 2011-04-11
Updated the TPM specification to improve stability.
Updated the Tecra R840 AMD VGA BIOS.
Version 2.10 - 2011-03-04
Implemented a change to the TOSHIBA PC Health Monitor battery state display.
Version 2.00 - 2011-03-01
Implemented the Intel Cougar Point Reference Code Update and Cougar Point B3-step CRID support.
Implemented the Intel Sandy Bridge Reference Code Update.
Fixed: Targus USB Mouse is not recognized after resuming from hibernation.
Version 1.50 - 2011-01-27
Initial production BIOS for these models.

[tlordon]

i just wanted to say if the video was from toshiba usa the class would be an argument for a split second (you will see below) however in uk they dont have consumer class so its all of them.
and going back even the class is an issue they still pulled the copper fins/grid from all the models US and UK. so its still valid suit.
and with the thin plate on at least mine its going to be same or near the 5005 suit just a bit different.
the cpu impo will still die early as it lets cpu get hotter than should and heat is what kills even if its 10c over a good machine at all times it wont last as long.
let me know if the helps explain my point.

[tlordon]

thought i would post this to the point i say about the al fins going to fall off eventully IE be like not having any heatsink and then death for the cpu thus the 5005 suit again poor thermal managment reslting in premiture failure.


this is from

But explains it very well in plain english i took out the ones not needed.
but in short it says al will expand contact 33% more than the copper so when the heat pipe and fins heat up it will all push on each other and the fins not being copper wont expand the same as the copper pipe and with the 33% more means its moving quite a bit and thus it will eventully seperate.(all the things below say this)

Coppers benifits
Lower Coefficient of Expansion - Aluminum will creep and move approximately 33% more than copper. This large movement will eventually lead to fatigue failure in rotor material due to thermal expansion and contraction. ETI's copper rotor design ensures higher reliability compared to aluminum bars.

Tensile Strength - Copper is 300% stronger than aluminum and thus able to withstand high centrifugal force and repeated hammering of the current-induced forces during each start.

Higher Melting Point - Copper can better withstand thermal cycling over the life of the motor.

Conservative Temperature Rise - Copper features conservative temperature rise limitations which prevent excessive deterioration in mechanical properties.

[tlordon]

at
YouTube - ‪Toshiba Portege R830, R840, R850 Business Notebooks‬‏
at 1:40 he states the main differences in the business models. and doesnt say any thing about different heatsink design thus leading me to beleive the other videos heatsink advertised as copper is a Entire class thing IE r830 and r835..
this is if we are debating the class being the copper difference.

[tlordon]

there is a express card slot avail on some of the units (just premting that now, that is not in debate)

also if you notice in that video the memory cover has holes in it.

that is another thing i have a beef with..
mine ducts the air threw the whole notbook and i guess it hopes all of it goes threw the fins (unfort not the case i felt some air from lan port. )

so on some i guess they have the pads placed so it forces all that air over half the motherboard and to the fins and in ours open to the whole case. i noticed a bit of that in the vidoe embed in my video and in this most recent video confirms that as if mine had vented memory cover as it sits it would vent the air threw that instead of the fins. (i allready had my mem cover on and off during a run and when that cover came off the cpu temps whent up IE the air whent out the big memory hole and not threw the fins. Hense its not ducted the same either.


so does that mean if we buy the consumer model we are getting severly shorted on the thermal managment. i can see and live with a i3 vs 95 or i7 and not have fingerprint reader and dock like the one video says are the main differences but to have such a half tushhied thermal is just Crap idea.

[tlordon]

last one promise.
i need to take a nap anyways. just got done with the last of my INTL calls and need to do domestic work in 3 hours.

note:
on the initial toshiba video claiming CU fins/grid it has a solid memory door cover.
on the other one i linked above from a toshiba rep. shows a vented memory cover. so there's a difference there to between all of them..
so on original one i saw ducting so the cpu, power chips bit more are in air flow and little bits of air gets to the other parts of MB and NB.
on mine there is no real ducting it just plows threw all of it. (see my video and you will see the toshiba ducting and mine) and then we see the video from toshiba rep that shows vented memory cover(for that to work being vented it need airtight ducting otherwise it will all vent threw memory cover and not threw fins. (do i make sense.)
k i gotta go now. but i was jumping from call to this and never got a free moment to fully get my thoughts out.


i think someone got on a "lets change this" kick.

[cricketsi]

i just wanted to say if the video was from toshiba usa the class would be an argument for a split second (you will see below) however in uk they dont have consumer class so its all of them.
and going back even the class is an issue they still pulled the copper fins/grid from all the models US and UK. so its still valid suit.
and with the thin plate on at least mine its going to be same or near the 5005 suit just a bit different.
the cpu impo will still die early as it lets cpu get hotter than should and heat is what kills even if its 10c over a good machine at all times it wont last as long.
let me know if the helps explain my point.

I'm not arguing with your point btw, just wondering if that might have explained the difference. In the UK, we do have a consumer class, in the Satellite R830 as opposed to the Portege R830.

Your revelations have given me some cause for concern, but I've gone a pulled the trigger on buying the Satellite R830 - Satellite R830-143 - Product Specifications - Toshiba

I'll have a look for cooling system material when it arrives.

[Fok]

I'm not arguing with your point btw, just wondering if that might have explained the difference. In the UK, we do have a consumer class, in the Satellite R830 as opposed to the Portege R830.

Your revelations have given me some cause for concern, but I've gone a pulled the trigger on buying the Satellite R830 - Satellite R830-143 - Product Specifications - Toshiba

I'll have a look for cooling system material when it arrives.

Exact same specs as the nordic version though you have 2 gb extra ram in yours or so I think. The nordic one is also listed as a 'homeomputer' rougly translated.

I'm getting bad vibes from all of this and might send it back regardless and wait for the Asus U36SD which is supposed to show up in July.

[arjunk27]

I had a couple of questions regarding the R835. Is the heat sink issue a real concern? As in, does the laptop have any heating issues or loud fan noise problem? I was looking at the VAIO SB/SC and they seem to have a very annoying loud fan.

Apart from this I read in a few reviews that the Wifi is not up to the mark in the R835. Is that true? Any issues with limited range/speed while using Wifi?

Thanks!

[santhosh.sivajothi]

I had a couple of questions regarding the R835. Is the heat sink issue a real concern? As in, does the laptop have any heating issues or loud fan noise problem? I was looking at the VAIO SB/SC and they seem to have a very annoying loud fan.

Apart from this I read in a few reviews that the Wifi is not up to the mark in the R835. Is that true? Any issues with limited range/speed while using Wifi?

Thanks!

I have been using my R835 with absolutely no problems with heating. There are no hotspots on the laptop at all, importantly the palm rest area and touchpad remain really cool. The only place where you can even feel any kind of warmth is near the vent, which is obvious. The previous gen R700 had heating issues, but they have all been fixed with the R835.

As far as WiFi is concerned, I did not notice any difference with my previous laptop. Signal strength both at home and work seem to be the same. YMMV