Intel ME Firmware (SA-00086) security flaw

Discussion in '2015+ Alienware 13 / 15 / 17' started by VICKYGAMEBOY, Nov 24, 2017.

  1. VICKYGAMEBOY

    VICKYGAMEBOY Notebook Deity

    Reputations:
    191
    Messages:
    759
    Likes Received:
    406
    Trophy Points:
    76
    @Vasudev another date change. from 14th to 19th.. this is BS..
     
    Papusan and Vasudev like this.
  2. Vasudev

    Vasudev Notebook Prophet

    Reputations:
    2,319
    Messages:
    5,584
    Likes Received:
    3,414
    Trophy Points:
    431
    We may never see the light of it.
     
    VICKYGAMEBOY likes this.
  3. Papusan

    Papusan BGABOOKS = That sucks!! STAHP! Dont buy FILTH...

    Reputations:
    10,183
    Messages:
    17,511
    Likes Received:
    25,183
    Trophy Points:
    931
    First priority... New models for 2018
     
  4. VICKYGAMEBOY

    VICKYGAMEBOY Notebook Deity

    Reputations:
    191
    Messages:
    759
    Likes Received:
    406
    Trophy Points:
    76
    wait what ?? they dint announce anything on CES2018 though..
     
    Vasudev likes this.
  5. Papusan

    Papusan BGABOOKS = That sucks!! STAHP! Dont buy FILTH...

    Reputations:
    10,183
    Messages:
    17,511
    Likes Received:
    25,183
    Trophy Points:
    931
    You expect Dell skip models for 2018?:D New and thinner!!
     
    Vasudev and VICKYGAMEBOY like this.
  6. Vasudev

    Vasudev Notebook Prophet

    Reputations:
    2,319
    Messages:
    5,584
    Likes Received:
    3,414
    Trophy Points:
    431
    Size zero or even thinner than current line-up.
     
  7. Papusan

    Papusan BGABOOKS = That sucks!! STAHP! Dont buy FILTH...

    Reputations:
    10,183
    Messages:
    17,511
    Likes Received:
    25,183
    Trophy Points:
    931
    I expect Intel will go for thinner package (thinner PCB) for next gen H Mobile as well. Hence thinner notebook models. They brag everywhere about thinnes. Intel and the ODM/OEM*s. Why should they change goal?:rolleyes:
    [​IMG]
     
    Vasudev likes this.
  8. Vasudev

    Vasudev Notebook Prophet

    Reputations:
    2,319
    Messages:
    5,584
    Likes Received:
    3,414
    Trophy Points:
    431
    I hope Intel boards don't etch very thin lines on board so that consumers will replace PCs every 3 months USD 3000 every 3 months in a way to keep the hardware and SW at latest and greatest version.
     
  9. Papusan

    Papusan BGABOOKS = That sucks!! STAHP! Dont buy FILTH...

    Reputations:
    10,183
    Messages:
    17,511
    Likes Received:
    25,183
    Trophy Points:
    931
    Intel can't do much regarding shrinking the die thickness as same die is used all over, but they can and will shrink the PCB thickness for BGA. They did it for LGA as you know. And they will up the game for BGA and continue make BGA package thinner for thinner notebooks. They have already give they word on this. They have promised this for a long time. Mind J00, the ODM/OEM*s will handle overheating with firmware/software no problem, the notebook will hold a while without you need to replace it all too soon.
     
    Vasudev likes this.
  10. VICKYGAMEBOY

    VICKYGAMEBOY Notebook Deity

    Reputations:
    191
    Messages:
    759
    Likes Received:
    406
    Trophy Points:
    76
Loading...

Share This Page