Full review Kingston Impact 2666

Discussion in 'Hardware Components and Aftermarket Upgrades' started by KLICHO, Apr 4, 2020.

  1. KLICHO

    KLICHO Notebook Consultant

    Reputations:
    1
    Messages:
    129
    Likes Received:
    8
    Trophy Points:
    31
    Hello i need full specs of Kingston Impact 2666 HX426S15IB2 in bios or Other programs i know only 16-17-17-35-468-2T but this is not all, I want know full specs. Any one can help me ?
     
  2. tilleroftheearth

    tilleroftheearth Wisdom listens quietly...

    Reputations:
    4,975
    Messages:
    12,363
    Likes Received:
    2,361
    Trophy Points:
    631
  3. KLICHO

    KLICHO Notebook Consultant

    Reputations:
    1
    Messages:
    129
    Likes Received:
    8
    Trophy Points:
    31
    This is in Complete data base. This is small information.
     
  4. senso

    senso Notebook Deity

    Reputations:
    393
    Messages:
    1,287
    Likes Received:
    492
    Trophy Points:
    101
    What do you want to know?
    If you want all timing parameters, either you need a BIOS that allows RAM OC that shows all the parameters, or use Tayphoon Burner to read them.
     
    tilleroftheearth likes this.
  5. Casowen

    Casowen Notebook Evangelist

    Reputations:
    34
    Messages:
    314
    Likes Received:
    89
    Trophy Points:
    41
    Manufacturing Description
    Module Manufacturer: Kingston
    Module Part Number: KHX2666C15S4/16G
    DRAM Manufacturer: Samsung
    DRAM Components: K4A8G085WB-BCPB
    DRAM Die Revision / Process Node: B / 20 nm
    Module Manufacturing Date: Week 23, 2018
    Manufacturing Date Decoded: June 4-8, 2018
    Module Manufacturing Location: Keelung, Taiwan
    Module Serial Number: (excluded)
    Manufacturing Identification Number: (excluded)
    Module PCB Revision: 00h
    Physical & Logical Attributes
    Fundamental Memory Class: DDR4 SDRAM
    Module Speed Grade: DDR4-2666
    Base Module Type: SO-DIMM (68.60 mm)
    Module Capacity: 16384 MB
    Reference Raw Card: E1 (10 layers)
    JEDEC Raw Card Designer: Samsung
    Module Nominal Height: 29 < H <= 30 mm
    Module Thickness Maximum, Front: 1 < T <= 2 mm
    Module Thickness Maximum, Back: 1 < T <= 2 mm
    Number of DIMM Ranks: 2
    Address Mapping from Edge Connector to DRAM: Mirrored
    DRAM Device Package: Standard Monolithic
    DRAM Device Package Type: 78-ball FBGA
    DRAM Device Die Count: Single die
    Signal Loading: Not specified
    Number of Column Addresses: 10 bits
    Number of Row Addresses: 16 bits
    Number of Bank Addresses: 2 bits (4 banks)
    Bank Group Addressing: 2 bits (4 groups)
    DRAM Device Width: 8 bits
    Programmed DRAM Density: 8 Gb
    Calculated DRAM Density: 8 Gb
    Number of DRAM components: 16
    DRAM Page Size: 1 KB
    Primary Memory Bus Width: 64 bits
    Memory Bus Width Extension: 0 bits
    DRAM Post Package Repair: Supported
    Soft Post Package Repair: Not supported
    DRAM Timing Parameters
    Fine Timebase: 0.001 ns
    Medium Timebase: 0.125 ns
    CAS Latencies Supported: 11T, 12T, 13T, 14T,
    15T, 16T, 17T, 18T
    Minimum Clock Cycle Time (tCK min): 0.750 ns (1333.33 MHz)
    Maximum Clock Cycle Time (tCK max): 1.600 ns (625.00 MHz)
    CAS# Latency Time (tAA min): 11.250 ns
    RAS# to CAS# Delay Time (tRCD min): 12.750 ns
    Row Precharge Delay Time (tRP min): 12.750 ns
    Active to Precharge Delay Time (tRAS min): 26.250 ns
    Act to Act/Refresh Delay Time (tRC min): 45.000 ns
    Normal Refresh Recovery Delay Time (tRFC1 min): 350.000 ns
    2x mode Refresh Recovery Delay Time (tRFC2 min): 260.000 ns
    4x mode Refresh Recovery Delay Time (tRFC4 min): 160.000 ns
    Short Row Active to Row Active Delay (tRRD_S min): 5.250 ns
    Long Row Active to Row Active Delay (tRRD_L min): 5.250 ns
    Write Recovery Time (tWR min): 15.000 ns
    Short Write to Read Command Delay (tWTR_S min): 2.500 ns
    Long Write to Read Command Delay (tWTR_L min): 7.500 ns
    Long CAS to CAS Delay Time (tCCD_L min): 5.250 ns
    Four Active Windows Delay (tFAW min): 22.500 ns
    Maximum Active Window (tMAW): 8192*tREFI
    Maximum Activate Count (MAC): Unlimited MAC
    DRAM VDD 1.20 V operable/endurant: Yes/Yes
    Thermal Parameters
    Module Thermal Sensor: Not Incorporated
    SPD Protocol
    SPD Revision: 1.1
    SPD Bytes Total: 512
    SPD Bytes Used: 384
    SPD Checksum (Bytes 00h-7Dh): FF2Eh (OK)
    SPD Checksum (Bytes 80h-FDh): 2355h (OK)
    Part number details
    JEDEC DIMM Label: 16GB 2Rx8 PC4-2666-SE1-11
    Frequency CAS RCD RP RAS RC RRDS RRDL WR WTRS WTRL FAW
    1333 MHz 18 17 17 35 60 7 7 20 4 10 30
    1333 MHz 17 17 17 35 60 7 7 20 4 10 30
    1333 MHz 16 17 17 35 60 7 7 20 4 10 30
    1333 MHz 15 17 17 35 60 7 7 20 4 10 30
    1200 MHz 14 16 16 32 54 7 7 18 3 9 27
    1067 MHz 13 14 14 28 48 6 6 16 3 8 24
    1067 MHz 12 14 14 28 48 6 6 16 3 8 24
    933 MHz 11 12 12 25 42 5 5 14 3 7 21
    Intel Extreme Memory Profiles
    Profiles Revision: 2.0
    Profile 1 (Certified) Enables: Yes
    Profile 2 (Extreme) Enables: No
    Profile 1 Channel Config: 2 DIMM/channel
    XMP Parameter Profile 1 Profile 2
    Speed Grade: DDR4-2666 N/A
    DRAM Clock Frequency: 1333 MHz N/A
    Module VDD Voltage Level: 1.20 V N/A
    Minimum DRAM Cycle Time (tCK): 0.750 ns N/A
    CAS Latencies Supported: 18T,17T,16T,15T,
    14T,13T,12T,11T,
    9T N/A
    CAS Latency Time (tAA): 15T N/A
    RAS# to CAS# Delay Time (tRCD): 17T N/A
    Row Precharge Delay Time (tRP): 17T N/A
    Active to Precharge Delay Time (tRAS): 35T N/A
    Active to Active/Refresh Delay Time (tRC): 60T N/A
    Four Activate Window Delay Time (tFAW): 30T N/A
    Short Activate to Activate Delay Time (tRRD_S): 7T N/A
    Long Activate to Activate Delay Time (tRRD_L): 7T N/A
    Normal Refresh Recovery Delay Time (tRFC1): 467T N/A
    2x mode Refresh Recovery Delay Time (tRFC2): 347T N/A
    4x mode Refresh Recovery Delay Time (tRFC4): 214T N/A


    SPD Binary:
    000 23 11 0C 03 85 21 00 08 00 40 00 03 09 03 00 00
    010 00 00 06 0D F0 0F 00 00 5A 66 66 10 D2 68 F0 0A
    020 20 08 00 05 00 B4 2A 2A 2A 00 78 00 14 3C 00 00
    030 00 00 00 00 00 00 00 00 00 00 00 00 0B 2B 0C 2B
    040 2B 0B 16 36 00 00 15 2C 0B 35 16 36 16 36 00 00
    050 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
    060 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
    070 00 00 00 00 00 00 00 00 00 00 00 00 E7 00 2E FF
    080 0F 11 24 01 00 00 00 00 00 00 00 00 00 00 00 00
    090 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
    0A0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
    0B0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
    0C0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
    0D0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
    0E0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
    0F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 55 23
    100 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
    110 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
    120 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
    130 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
    140 01 98 01 18 23 6D 10 24 20 4B 48 58 32 36 36 36
    150 43 31 35 53 34 2F 31 36 47 20 20 20 20 00 80 CE
    160 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 88
    170 07 38 30 36 36 39 30 39 00 00 01 01 00 00 00 00
    180 0C 4A 05 20 00 00 00 00 00 94 00 00 06 F4 0F 00
    190 00 5A 66 66 10 D2 68 F0 0A 20 08 00 05 00 B4 2A
    1A0 2A 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
    1B0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
    1C0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
    1D0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
    1E0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
    1F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
     
    tilleroftheearth likes this.
Loading...

Share This Page