Clevo Overclocker's Lounge

Discussion in 'Sager/Clevo Reviews & Owners' Lounges' started by Spartan@HIDevolution, Mar 4, 2016.

  1. BrightSmith

    BrightSmith Notebook Evangelist

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    Is there any way to check my VRAM temps? Can't see it in Hwinfo64 nor gpu-z.
     
  2. yrekabakery

    yrekabakery Notebook Virtuoso

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    Nope, VRAM doesn’t have temp sensors.
     
  3. Meaker@Sager

    Meaker@Sager Company Representative

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    Generally not an issue to be fair.
     
  4. BrightSmith

    BrightSmith Notebook Evangelist

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    I had to reattach a thermal pad when repasting and wanted to check if it did its its job...
     
  5. Meaker@Sager

    Meaker@Sager Company Representative

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    Check if it has a slight impression from the chip.
     
  6. BrightSmith

    BrightSmith Notebook Evangelist

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    That would be the practical solution indeed, but then I would have to repaste again with LM, retape the die, etc which I'm loath to do because I have great temps now.
     
  7. Meaker@Sager

    Meaker@Sager Company Representative

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    LM you can usually get away with just leaving for a quick swap off and on of the heatsink. Either way it's probably fine.
     
  8. Johnksss

    Johnksss .

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  9. jc_denton

    jc_denton V̖̟en̰g̻̼̰̩͙ea̲n̪c̭e̼ ͍̘̤͓̟̤Is̙͔ ̤Mi̻̭̣͎͍ͅn̰ḙ

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    Just when I thought I was done messing with my kit, @Johnksss comes in sets the bar even higher! ~3800Mhz at CL17!
    Honestly, that's very impressive knowing the lengths and pains you go through to get there. Lots of testing involved just to get that kind of speed to boot.

    How was the process of getting there this time around?
     
    Johnksss and Papusan like this.
  10. jc_denton

    jc_denton V̖̟en̰g̻̼̰̩͙ea̲n̪c̭e̼ ͍̘̤͓̟̤Is̙͔ ̤Mi̻̭̣͎͍ͅn̰ḙ

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    Pad impression, or take the heatsink out and mount the card, then shine a light and check if it bleeds through.

    I just did the same on my vapor chamber, and can see that there is no contact between heatsink and ram modules towards the power stages. A piece of paper passes right between there.
    There are 0.5mm pads there and after removing rest of the pads to check whether they might have been the cause for poor contact, there is still this gap. Using 1mm pads instead, results in a substantial gap between die and vapor chamber, paired with liquid metal it's a problem.

    Not sure whether to get some K5 Pro and put that on the GDDR5X chips, since 0.5mm pads are Fujipoly Extreme with a high thermal rating. What do you guys reckon?
     
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