Official ICD7 Thread

[DestruyaX]

"Gap-filling" with a TIM is not a good idea. The whole notion of non-pad TIMs is that by compression you work out the air bubbles/pockets and mate the surfaces as closely as possible with a medium between them that maximizes the mating of chip and heatsink.

Using a "big glob" of something like ICD 7 doesn't make that happen.

If you massacred your pad, buy a replacement here: http://www.coolerguys.com/840556020769.html

[Hello_Moto]

how come other people including some reputable forum members dont seem to share your viewpoint - I dont know whose advice to follow lol!

then again, i cant really do much about it now given that my thermal pad was discarded about 4 weeks ago and replaced with a generous application of ICD7; seems to be working fine for me.

[flipfire]

You cannot use thermal paste in place of a thermal pad. There will be a .5 - 1.5mm gap, and paste will only cover a fraction of that. Trying to fill up that gap with paste is silly.

You can either use a better thermal pad or the copper mod.

[TANWare]

I presently use it on my "GAP" over the northbridge with great success. ICD is not thin like a normal TIM. it is quite thick and can be used on a limited sized gap without issue.........

[Capper5016]

Originally Posted by flipfire

You cannot use thermal paste in place of a thermal pad. There will be a .5 - 1.5mm gap, and paste will only cover a fraction of that. Trying to fill up that gap with paste is silly.

You can either use a better thermal pad or the copper mod.

Originally Posted by DestruyaX

"Gap-filling" with a TIM is not a good idea. The whole notion of non-pad TIMs is that by compression you work out the air bubbles/pockets and mate the surfaces as closely as possible with a medium between them that maximizes the mating of chip and heatsink.

Using a "big glob" of something like ICD 7 doesn't make that happen.

If you massacred your pad, buy a replacement here: http://www.coolerguys.com/840556020769.html

Originally Posted by Hello_Moto

how come other people including some reputable forum members dont seem to share your viewpoint - I dont know whose advice to follow lol!

then again, i cant really do much about it now given that my thermal pad was discarded about 4 weeks ago and replaced with a generous application of ICD7; seems to be working fine for me.

Maybe you trolls (sound like company reps to be honest) should do some research and reading before spouting off ignorance........theres probably 40 pages of results here that disagree with you.

Lets also clear up the whole "thermal pad" thing....thermal pads suck . They are terrible at transferring heat, and typically break down pretty quickly. As to the copper mod, its works well, but to be honest not as well as ICD7, not to mention the fact you are adding three layers to the equation, all of which are electrically conductive.

[Kamin_Majere]

maybe you can calm down, if anyone sounds like a company rep its you.

Disagree all you want to, but do it civilly. This is the second time i've had to say this in this thread, its very informative and (IMO) useful, but the next time i will start doing more than warning

Kamin_Majere

[flipfire]

I think you should pull your head out of the ICD7 fanboy club and actually read and listen. Dont get aggravated just because others said otherwise.

Originally Posted by c19932

hey everyone I just tried my icd7 today on my benq s41 laptop and i gotta say, epic failure on my part. I threw away all my old thermal pads, and after applying icd7, my gpu temp went insane, it reached 100 degrees (normally its only 75). So I immediately shut it down and know i did something wrong. My guess is that my gpu and heatsink aren't touching. What are some other possibility? I also threw away the old pads for my gpu memory..is it ok to put icd on those?

A lot of notebooks have fixed heatsink heights. A thermal pad can leave a gap between .5 - 2mm. So a better thermal pad or copper mod is the only solution. You would have to use a thermal paste thick as chocolate to cover it.

I tried to use thick paste on my 8400m before and it just overheated after 3mins of gaming. I could physically see the gap between the GPU die and HSF when i pulled out the system board.

If your heatsink can compress it down to the surface/die and remove the clearance then yeah thermal paste will be the ideal solution.

Yes we all know thermals pads suck and crumble like crap.

[TANWare]

Originally Posted by flipfire

I think you should pull your head out of the ICD7 fanboy club and actually read and listen. Dont get aggravated just because others said otherwise.



A lot of notebooks have fixed heatsink heights. A thermal pad can leave a gap between .5 - 2mm. So a better thermal pad or copper mod is the only solution. You would have to use a thermal paste thick as chocolate to cover it.

I tried to use thick paste on my 8400m before and it just overheated after 3mins of gaming. I could physically see the gap between the GPU die and HSF when i pulled out the system board.

If your heatsink can compress it down to the surface/die and remove the clearance then yeah thermal paste will be the ideal solution.

Yes we all know thermals pads suck and crumble like crap.

This is almost as thick as putty, more like the consistency of a silicon paste. Maybe even a bit thicker than that............

[flipfire]

Ok chocolate was a bad example, i was just hungry. Look even if it was thick, its volume will still need to fill up the height which will drastically reduce its ability to transfer heat.

Thermal paste is only meant to fill up microgaps/valleys in the cpu die surface to allow maximum heat conductivity to the heatsink.

[Capper5016]

Want to ban me thats up to you.......want to keep letting people bad advice? thats up to you too.

As to me being a "company rep", maybe the mods should do a little reading and research as well before jumping in. Sorry, but it just gets tiresome to see the same thing over and over again, "experts" chiming in with no experience on the topic, disregarding more than 40 pages of discussion, and standing on their soapbox talking about how they know better. Wanna learn something, stop by my place and borrow some of my equipment, or grab a seat and look over more than a year of data on thermal compounds....

Originally Posted by flipfire

Ok chocolate was a bad example, i was just hungry. Look even if it was thick, its volume will still need to fill up the height which will drastically reduce its ability to transfer heat.

Thermal paste is only meant to fill up microgaps/valleys in the cpu die surface to allow maximum heat conductivity to the heatsink.

again, READING IS YOUR FRIEND..... we are talking about .5-1MM, not half an inch....